HR3 has a perfect balance of body size and heat dissipation through its 20 -ayer PCB stacking design and 10Gbps Serdes on-board interconnection technology. At the same time, thanks to the selfdeveloped array parallel storage architecture, the maximum storage in the device can be expanded to 4TB
| Model | HR3-101 | HR3-103 | HR3-105 | HR3-108 | HR3-502 |
| Full frame resolution | 1280×1024 | 1280×1024 | 1280×1024 | 1280×1024 | 2560×1920 |
| Full frame rate | 1000fps | 3000fps | 5000fps | 8000fps | 2000fps |
| Pixel size | 14.6μm | 14.6μm | 14.6μm | 14.6μm | 7.8μm |
| Minimum Exposure Time | 100ns | ||||
| Dynamic Range | 64dB | ||||
| Analog Gain | x2, x4, x8 | ||||
| Bit depth | 8bit | 8bit/10bit | |||
| Color | Monochrome (M) / Color (C) | ||||
| Input signal | Trigger signal, synchronization signal, Ready signal, IRIG-B signal | ||||
| Output signal | Trigger signal, synchronization signal, Ready signal | ||||
※ For detailed parameters, please contact the sales team.
Powering Vision, Enabling Automation
Tel：+86 15764350171（WhatsApp）
Email：info@hanron-tech.com
Address：No. 3777 Shengtai Street, Nanguan District, Changchun City, P.R.China
